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RMWB04001
June 2004
RMWB04001
4 GHz Buffer Amplifier MMIC
General Description
The RMWB04001 is a 2-stage GaAs MMIC amplifier designed as a 3.5 to 4 GHz Buffer Amplifier for use in point to point and point to multi-point radios, and various communications applications. In conjunction with other amplifiers, multipliers and mixers it forms part of a complete 23 and 26 GHz transmit/receive chipset. The RMWB04001 utilizes our 0.25m power PHEMT process and can be used in a variety of applications requiring a high gain medium power amplifier.
Features
* 4 mil substrate * Small-signal gain 27dB (typ.) * Saturated Power Out 20dBm (typ.) * Voltage Detector Included to Monitor Pout * Chip size 2.4mm x 1.3mm x 100m
Device
Absolute Ratings
Symbol Vd Vg Vdg ID PIN TC TSTG RJC Parameter Positive DC Voltage (+4V Typical) Negative DC Voltage Simultaneous (Vd-Vg) Positive DC Current RF Input Power (from 50 source) Operating Baseplate Temperature Storage Temperature Range Thermal Resistance (Channel to Backside) Ratings +6 -2 8 168 +7 -30 to +85 -55 to +125 140 Units V V V mA dBm C C C/W
(c)2004 Fairchild Semiconductor Corporation
RMWB04001 Rev. C
RMWB04001
Electrical Characteristics (At 25C), 50 system, Vd = +4V, Quiescent Current (Idq) = 36mA
Parameter Frequency Range Gate Supply Voltage1 (Vg) Gain (Small Signal at Pin = -12dBm) Gain Variation vs. Frequency Power Output Saturated: (Pin = -2dBm) Input Return Loss (Pin = -12dBm) Output Return Loss (Pin = -12dBm) DC Detector Voltage at Pout = 20dBm
Note: 1: Typical range of gate voltage is -1 to -0.4V to set typical Idq of 36mA.
Min 3.5 24 18
Typ -0.7 27 0.5 20 14 12 0.5
Max 4.0
Units GHz V dB dB dBm dB dB V
Functional Block Diagram1
DRAIN SUPPLY Vd1 DRAIN SUPPLY Vd2 OUTPUT POWER DETECTOR VOLTAGE Vdet
MMIC CHIP RF IN RF OUT
GROUND (Back of Chip)
GATE SUPPLY Vg
Note: 1: Detector delivers > 0.1V DC into 3k load resistor for > 20dBm output power. If output power level detection is not desired, do not make connection to detector bond pad.
(c)2004 Fairchild Semiconductor Corporation
RMWB04001 Rev. C
RMWB04001
Application Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high thermal conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment for power devices should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. Recommended wire bonding uses 3mils wide and 0.5mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 12 mils long corresponding to a typical 2 mil gap between the chip and the substrate material.
0.00 1.30 1.19
0.57
1.32
2.08 2.28
2.40 1.30 1.19
0.57
0.57
0.11 0.00 0.00 0.11 Dimensions in mm 1.14 2.28 2.40
0.11 0.00
Figure 1. Chip Layout and Bond Pad Locations Chip Size is 2.40mm x 1.3mm X 100m. Back of chip is RF and DC Ground.
(c)2004 Fairchild Semiconductor Corporation
RMWB04001 Rev. C
RMWB04001
Drain Supply Vd=4 V
Output Power Detector Voltage Vdet 10,000 pF 3 k L L 100 pF L L L 100 pF
L = Bond Wires
100 pF
MMIC CHIP
RF IN
RF OUT
L
100 pF
Ground (Back of Chip)
L 10,000 pF
Gate Supply Vg Note: Detector delivers > 0.1V DC into 3k load resistor for >20 dBm output power. If output power level detection is not desired, do not connect to detector bond pad.
Figure 2. Recommended Application Schematic Circuit Diagram
10,000pF Die-Attach 80Au/20Sn 100pF 100pF 5mil Thick Alumina 50-Ohm RF Input Drain Supply Vd= 4 3k Output Power Detector Voltage Vdet 100pF
5 mil Thick Alumina 50-Ohm RF Output
100pF 10,000pF 2 mil Gap Gate Supply Vg
L< 0.015" (2 Places)
Note: Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Figure 3. Recommended Assembly Diagram
(c)2004 Fairchild Semiconductor Corporation RMWB04001 Rev. C
RMWB04001
Recommended Procedure for Biasing and Operation
CAUTION: LOSS OF GATE VOLTAGE (Vg) WHILE DRAIN VOLTAGE (Vd) IS PRESENT MAY DAMAGE THE AMPLIFIER CHIP. The following sequence of steps must be followed to properly test the amplifier: Step 1: Turn off RF input power. Step 2: Connect the DC supply grounds to the ground of the chip carrier. Slowly apply negative gate bias supply voltage of -1.5V to Vg. Step 3: Slowly apply positive drain bias supply voltage of +4V to Vd. Step 4: Adjust gate bias voltage to set the quiescent current of Idq = 36mA. Step 5: After the bias condition is established, the RF input signal may now be applied at the appropriate frequency band. Step 6: Follow turn-off sequence of: (i) Turn off RF input power, (ii) Turn down and off drain voltage (Vd), (iii) Turn down and off gate bias voltage (Vg).
(c)2004 Fairchild Semiconductor Corporation
RMWB04001 Rev. C
RMWB04001
Performance Data
Typical Small Signal Performance On-Wafer measurements, Vd = 4V, Idq = 36mA, T = 25C
28 27 S21 (dB) 26 25 24 23 22 3.5 3.6 3.7 3.8 3.9 4 FREQUENCY (GHz) S22 S11 S21 0 S11, S22 (dB) -5 -10 -15 -20 -25 -30 30 25 S21 (dB) 20 15 10 5 0 0 1 2 3 4 5 FREQUENCY (GHz) 6 S11 S22 S21 0 S11, S22 (dB)
RMWB04001 Rev. C
-5 -10 -15 -20 -25 -30
Power Output and Gain vs. Power In 50 Fixture Measurements, Vd = 4V, Idq = 36mA, T = 25C
22 20 18 Pout (dBm) 16 14 12 10 8 -16 -14 -12 -10 -8 -6 -4 -2 3.5 GHz 4.0 GHz 29 28 27 26 25 24 23 22 PIN (dBm) GAIN (dB) G3dB (dBm)
Power Output and Gain at 3dB vs. Frequency and Temperature 50 Fixture Measurements, Vd = 4V, Idq = 36mA
20.2 P3dB (T = 25C) G3dB (T = 25C) 20.1 P3dB (dBm) P3dB (T = 75C) 20.0 G3dB (T = 75C) 19.9 22.4 22.8 23.2 23.6
19.8 3.5 3 .6 3.7 3.8 3.9 FREQUENCY (GHz)
22.0 4.0
(c)2004 Fairchild Semiconductor Corporation
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DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I11

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